T-FORCE VULCAN Z is designed for complete protection and enhanced heat dissipation. The heat spreader is formed by the punch-press process with a 0.8mm thick, one-piece alloy aluminum to reinforce the body structure. In addition, coloring with an electrolytic anodizing process can enhance corrosion resistance and make it non-conductive.
With superconductivity and thermally conductive adhesive, these memory modules can quickly transfer the heat on IC chip through heat conduction to the aluminum alloy cooling module for better heat dissipation.
Every IC chip made for TEAMGROUP’s T-FORCE VULCAN Z DDR4 gaming memory is selected through a rigorous testing process. All overclocking memory is tested for complete compatibility and stability. This offers gamers a DDR4 memory with excellent quality, optimal performance, stability and compatibility.
It is compatible to both Intel & AMD platforms, therefore gamers can build their system without worries.
By using the XMP 2.0 technology, users are able to experience the thrill of overclocking easily.
The basic working voltage is decreased to 1.2V. VULCAN Z saves on energy, has high performance and low power consumption.
|DDR4 288-Pin Non-ECC Unbuffered DIMM
|4GB, 8GB, 16GB, 2x 4GB, 2x 8GB and 2x 16GB
|Data Transfer Bandwidth
|21,328 MB/s(PC4 21300)
|24,000 MB/s(PC4 24000)
|25,600 MB/s(PC4 22600)
|140(L)mm x 31.6(W)mm x 7(H)mm
|Aluminum heat spreader