Descripción
- AMD AM4 Socket: Ready for 2nd and 3rd Gen AMD RyzenTM processors
- Enhanced Power Solution: Military-grade TUF components, ProCool socket and Digi+ VRM for maximum durability
- Comprehensive Cooling: Active PCH heatsink, VRM heatsink, M.2 heatsink, hybrid fan headers and Fan Xpert 4
- Next-Gen Connectivity: Dual PCIe 4.0 M.2 and USB 3.2 Gen 2 Type-A /Type-C
- Gaming Networking: Exclusive Realtek® L8200A Gigabit Ethernet, Intel 2×2 802.11ac Wi-Fi with MU-MIMO support, Bluetooth 5.0, TUF LANGuard and TurboLAN technology
- Realtek S1200A Codec: Features an unprecedented 108dB signal-to-noise ratio for the stereo line-out and a 103dB SNR for the line-in, providing pristine audio quality
- Aura Sync RGB: Synchronize LED lighting with a vast portfolio of compatible PC gear, including addressable RGB strips
- TUF Gaming Alliance: ASUS hardware ecosystem ensures the best compatibility and complementary aesthetics from components to case
DURABLE. STABLE. RELIABLE.
TUF Gaming X570-Plus (Wi-Fi) distills the essential elements of the latest AMD platform and combines them with game-ready features and proven durability. Engineered with military-grade components, upgraded power solutions and a comprehensive set of cooling options, these motherboards deliver rock-solid performance with unwavering gaming stability.
When you build with a TUF Gaming motherboard, you also benefit from the TUF Gaming Alliance — an ASUS collaboration with trusted industry partners that ensures easier building, the best compatibility, and complementary aesthetics from components to case.
- TUF Gaming Armor
- USB 3.2 Gen 2 Type-C™
- USB 3.2 Gen 1
- Display Port
- HDMI Port
- Intel® Wi-Fi & BT 5.0
- USB 3.2 Gen 2
- Realtek® L8200A LAN
Turbo LAN Utility - Audio
- 2 x PCIe 4.0 X16 Slots
・ 2-Way CrossFireX™
・ ASUS SafeSlot - Realtek® S1200A
Exclusive DTS Custom for
GAMING Headsets
・TUF Gaming Audio Cover
・Audio Shielding
・Dedicated audio PCB layers
・Premium Japanese audio capacitors - ProCool Connector
- Dr. MOS
- DDR4
- Addressable Gen 2 RGB header
- AMD AM4 Socket
- 2 x Front USB 3.2 Gen 2 ports
- 2 x M.2 x4 PCIe Gen 4 & SATA mode
- 8 x SATA 3.0 ports
- AMD X570 Chipset
- Aura Sync
- 2 x RGB headers
- 4 x Front USB 2.0 ports
POWER DESIGN
6-LAYER PCB DESIGN
The TUF Gaming X570-Plus (Wi-Fi)’s CPU VRM utilizes 12+2 Dr. MOS power stages that combine high-side and low-side MOSFETs and drivers into a single package, delivering the power and efficiency that AMD’s latest processors demand.
PROCOOL SOCKETS
ENHANCED EATX 4-PIN & 8-PIN SOCKETS
- Solid and more durable
- Prevent hotspots and connector failure
Compared with traditional power inputs, ProCool sockets are built to tight specifications to ensure flush contact with the PSU power lines. This lowers impedance, which helps to prevent hotspots and connector failure.
TUF CHOKES
Certified military-grade TUF chokes deliver rock-steady power to the CPU, helping to improve system stability.
TUF CAPACITORS
+20% temperature tolerance and 5X-longer lifespan.
COOLER BY DESIGN
1. VRM HEATSINK
Large, high-mass heatsink with extensive surface that covers the VRM and choke areas.
THERMAL PAD
High-quality thermal pads help transfer heat from the inductor and phase array to the heatsink.
2. ACTIVE CHIPSET HEATSINK
A chipset heatsink with a dedicated chipset fan ensures optimal cooling for more stable performance.
3. M.2 HEATSINK
The M.2 heatsink keeps the M.2 SSD at the optimum operating temperature for consistent performance and reliability.
CUSTOM DELTA SUPERFLO FAN
The custom low-noise fan features a high-durability bearing with a 60,000-hour L10* lifespan.
AIR DUCT
A specially-designed air duct helps the fan generate static pressure and concentrates air flow over the fins.
FINNED HEATSINK
The heatsink fin density is optimized to maximize surface area while maintaining a low-resistance exhaust path.
* L10 bearing life is a standard metric that specifies the number of hours that 90% of the bearing are expected to continue successfully operating, as a minimum.
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