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ASUS ROG Maximus XIII Hero (WiFi 6E) Z590 LGA 1200 (Intel 11th/10th Gen) ATX PCIe 4.0 DDR4 5333+ Dual 2.5Gb LAN Thunderbolt 4

$481.950 IVA incl
Efectivo/Transferencia
$504.900 IVA incl
WebPay - Transbank
$518.670 IVA incl
Mercado Pago

Placa madre Intel®Z590 ATX para juegos con 14 + 2 etapas de potencia, PCIe 4.0, WiFi 6E integrado (802.11ax), Ethernet Intel® dual de 2.5 Gb, Quad M.2 con disipadores de calor y placas posteriores integradas, Thunderbolt 4 integrado dual, USB 3.2 Gen 2×2 Conector del panel frontal e iluminación Aura Sync RGB

 

Intel® Socket LGA 1200 para procesadores Intel® Core ™ de 11.a generación y procesadores Intel® CoreTM, Pentium® Gold y Celeron® de 10.a generación

Control inteligente: utilidades de software y firmware exclusivas de ASUS que simplifican la configuración y mejoran el rendimiento: AI Overclocking, AI Cooling, AI Networking y Two-Way AI Noise-Cancelation

Solución de potencia robusta: 14 + 2

😞 Sin Stock

Descripción

Intel® Z590 ATX gaming motherboard with 14+2 power stages, PCIe 4.0, Onboard Wi-Fi 6E (802.11ax), Dual Intel® 2.5 Gb Ethernet, Quad M.2 with heatsinks and embedded backplates, Dual onboard Thunderbolt 4, USB 3.2 Gen 2×2 front-panel connector and Aura Sync RGB lighting

  • Intel® Socket LGA 1200 for 11th Gen Intel® Core™ processors and 10th Gen Intel® Core™, Pentium® Gold and Celeron® Processors
  • Intelligent Control: ASUS-exclusive software and firmware utilities that simplify setup and improve performance: AI Overclocking, AI Cooling, AI Networking and Two-Way AI Noise Cancelation
  • Robust Power Solution: 14+2 teamed power stages rated for 90 Amps, ProCool II power connectors, MicroFine alloy chokes and 10K Japanese-made black metallic capacitors
  • Optimized Thermal Design: Enlarged VRM heatsinks plus integrated aluminum I/O cover, high-conductivity thermal pad, quad M.2 heatsinks with embedded backplates and ROG Water-Cooling Zone
  • High-performance Networking: Onboard Wi-Fi 6E (802.11ax), dual Intel® 2.5 Gb Ethernet and ASUS LANGaurd
  • Fastest Gaming Connectivity: PCIe 4.0, quad M.2, USB 3.2 Gen 2×2 front-panel connector, dual USB Type-C® ports with Thunderbolt™ 4 USB-C®
  • Industry-leading Gaming Audio: ROG SupremeFX ALC4082 with ESS® ES9018Q2C DAC for high-fidelity audio
  • Unmatched Personalization: ASUS-exclusive Aura Sync RGB lighting, including one RGB header and three addressable Gen 2 RGB headers
  • DIY-friendly Design: Pre-mounted I/O shield, BIOS FlashBack™, Q-Code, FlexKey, Q-Connector, SafeSlot and Graphics Card Holder
  • Renowned Software: Intuitive UEFI BIOS dashboard with integrated MemTest86
MAXIMUS XIII HERO

MAXIMUS XIII HERO

ROG Maximus XIII Hero continues to build on the legacy of its predecessors by packing upgraded power, smart cooling and lightspeed connectivity under a stealthy exterior. Bristling with renowned ROG features such as AI-enhanced controls and customizable Aura Sync illumination, the latest Hero is ready to take the helm of your high-end gaming build.

Intelligent Motherboard

Intelligent software solutions help ensure that your system performs at its best. The latest ASUS AI-powered enhancements span four pillars of performance, including overclocking, cooling, networking and onboard audio, making advanced tweaks and optimization accessible to new recruits and savvy PC DIY veterans alike.

AI Overclocking

Tuning is now faster and smarter than ever before. ASUS AI Overclocking profiles the CPU and cooling to predict the optimal configuration and push each system to its limits.

AI Cooling

Balance the thermals and acoustics of any build with a single click. A proprietary ASUS algorithm reduces unnecessary system noise by monitoring CPU temperatures and dynamically adjusting fans to optimal speeds.

AI Networking

GameFirst VI optimizes networking performance by allocating bandwidth in real time based on application usage scenarios and corresponding learning algorithms.

Two-Way AI Noise Cancelation

This utility leverages a massive deep-learning database to reduce over 500 million types of background noise from incoming or outgoing audio, helping ensure crystal-clear communication in games or calls.

SPEC OVERVIEW

Performance

Extreme Power & Performance

Product image
  1. PROCOOL II POWER CONNECTORS
  2. 14+2 POWER STAGES
  3. MULTI-GPU SLI® SUPPORT
    • 2 x PCIe 4.0 x16 slots* (x16, x8/x8, x8/x4)
    • 1 x PCIe 3.0 x16 slot (x4)
    • 1 x PCIe 3.0 x1 slot
  4. INTEL® SOCKET LGA1200
    11th Gen Intel® Core™ processors & 10th Gen Intel® Core™, Pentium® Gold and Celeron® Processors
  1. DDR4, 4 X DIMM
    • ASUS OptiMem III
    • Dual Channel
  2. 4 X M.2 SLOTS
    • 1 x M.2 2242-22110 supports PCIe 4.0 x4 mode
    • 1 x M.2 2242-2280 supports PCIe 4.0 x4 mode
    • 1 x M.2 2242-2280 supports PCIe 3.0 x4 mode
    • 1 x M.2 2242-22110 supports PCIe 3.0 x4 & SATA modes
*Specifications may vary, depending on CPU. Listed specifications are based on 11th Gen Intel® Core™ desktop processors.

Cooling

Comprehensive Cooling

Product image
  1. VRM & ALUMINUM I/O HEATSINK
  2. QUAD M.2 HEATSINKS & M.2 BACKPLATES
  1. MULTIPLE 4-PIN PWM FAN HEADERS
    • CHA_FAN headers support ASUS HYDRANODE
  2. ROG WATER-COOLING ZONE
    • W_FLOW tachometer
    • W_IN/OUT T-sensor

Gaming Immersion

Total Gaming Immersion

Product image
  1. I/O ZONE AURA LIGHTING
  2. SUPREMEFX ALC4082 CODEC
    • ESS® SABRE9018Q2C high definition DAC
    • 120 dB SNR stereo playback output
    • 113 dB SNR recording input
    • Gold-plated audio jacks

    SONIC STUDIO III + SONIC STUDIO VIRTUAL MIXER
    SONIC RADAR III
    DTS® SOUND UNBOUND

  1. 3 X 3-PIN ADDRESSABLE GEN 2 RGB HEADERS
    1 X 4-PIN AURA RGB HEADER
  2. CHIPSET ZONE AURA LIGHTING

Connectivity

Full Connectivity

Product image
  1. BIOS FLASHBACK™ BUTTON
  2. CLEAR CMOS BUTTON
  3. 1 X HDMI™ 2.0
  4. 2 X USB 2.0 PORTS
  5. INTEL® WI-FI 6E AX210
  6. 2 X THUNDERBOLT™ 4 USB TYPE-C® PORTS
  1. 2 X INTEL® I225-V 2.5 GB ETHERNET
  2. 6 X USB 3.2 GEN 2 PORTS
  3. OPTICAL S/PDIF OUT
  4. 1 X USB 3.2 GEN 2X2
    Front Panel Connector
  5. 6 X SATA 6 GB/S

DIY Friendly

Product image
  1. ROG PATENTED PRE-MOUNTED I/O SHIELD
  2. ESD GUARDS
    Providing greater electrostatic protection than the industry standard, ESD Guards cover the USB, audio and LAN ports.
  3. TRUEVOLT USB
    USB power supplies a rock-steady 5 volts to all USB ports, minimizing power fluctuations for minimal data loss.
  4. 2 X SAFESLOT
    A pair of SafeSlots provide stronger PCIe device retention and greater shearing resistance.
  5. ASUS HYDRANODE
    The three chassis fan headers feature the ASUS HYDRANODE circuit, which utilizes a powerline communication protocol to control up to three daisy chained fans independently through each 4-pin connector.
    1. Q-CODE
      The Q-Code LED provides 2-digit error codes that display system status to help with troubleshooting.
    2. 4 X Q-DIMM
      One-sided clips provide super-simple, super-secure handling of memory modules.
    3. FLEXKEY
      FlexyKey allows you to redefine the role of the chassis reset button. Assignable options include quick Aura lighting control, booting directly into UEFI, or performing a safe boot to recover settings.
    4. Q-CONNECTOR
      Sorts all front-panel cables for a neater set-up.

PERFORMANCE

With tailored power delivery and support for the latest high-performance memory, ROG Maximus XIII Hero easily handles the increased demands of Intel Rocket Lake processors. It features an intelligent VRM design that’s rated for 90 amps, plus quality components and memory layout optimizations to cater to enthusiasts looking to create a battle-ready rig with balanced performance.

Power Solution

Teamed Power Architecture

Today’s CPU architectures place incredible demands on motherboard power design by transitioning from deep power-saving modes, going from lower-power mode to full load in an instant. The latest ROG VRM architecture rises to the challenge by utilizing teamed power stages to rapidly swing current, while maintaining exemplary thermal performance.

A brief history

ASUS became the first manufacturer to implement phase-doublers with the A8N32-SLI Deluxe motherboard, back in 2005. The board’s VRM was lauded for elegantly overcoming the power handling capabilities of components that were available at the time while also reducing voltage ripple. Those benefits led to phase-doublers becoming universally accepted in the industry, and they are still used for similar purposes today.
<span style="color: #DA0100;">Teamed Power Stage Design</span>
Conventional Phase-doubled Design

Teamed Power Stage Design

Conventional Phase-doubled Design

A shift in CPU demands

However, today’s CPUs now pack more cores than their predecessors, and the latest instruction sets allow them to crunch computationally dense workloads at an incredible pace. In addition, they consume less power at idle and can transition between load states much more quickly. These improvements necessitate a re-evaluation of power-design priorities because phase-doublers add a propagation delay that hampers transient response.

While doublers help extend the number of effective phases, they do so at the cost of a processing delay.

<span style="color: #DA0100;">Teamed Power Stage Design</span>
Conventional Phase-doubled Design

Teamed Power Stage Design

Conventional Phase-doubled Design

Bucking the trend

Fortunately, the latest integrated power components can handle higher currents than the devices of yesteryear, making it possible to implement a simple circuit topology that isn’t hamstrung by the processing lag of phase-doublers. That’s why ROG Maximus XIII Hero utilizes teamed power stages to deliver higher burst current per phase, while maintaining the thermal performance of phase-doubled designs.

The teamed architecture allows two power stages to work in tandem to provide more power to the CPU.

<span style="color: #DA0100;">Teamed Power Stage Design</span>
Conventional Phase-doubled Design

Teamed Power Stage Design

Conventional Phase-doubled Design

Thermal performance

Each VRM component serves a specific purpose. PWM controllers and phase-doublers control the circuit, and the power stages do the heavy lifting from an electrical and thermal standpoint. That’s why ROG Maximus XIII Hero utilizes 16 power stages. The power stage sits at the top of Infineon’s lineup and features a low RDSON to reduce switching and conduction losses, helping to improve overall thermal headroom.

The MOSFETs within the power stages generate the most heat as they are responsible for voltage conversion and delivery to the CPU from the 12-volt EPS connector.

<span style="color: #DA0100;">Teamed Power Stage Design</span>

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